Investigation of polyimide-mica hybrid films for cryogenic applications

Composites Science and Technology

Volumn 65, Issue 11-12, 2005, Pages 1743-1748

  Zhang, Yi He ^a,b,c   Fu, Shao Yun ^a   Li, Robert K Y ^c   Wu, Jun Tao ^d   Li, Lai Feng ^a   Ji, Jun Hui ^a   Yang, Shi Yong ^d  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

^c CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^d INSTITUTE OF CHEMISTRY   (China)

Author keywords

Cryogenic temperature; Mechanical properties; Mica; Polyimide

Indexed keywords

FRACTURE; GLASS TRANSITION; LOW TEMPERATURE PHENOMENA; MECHANICAL TESTING; MICA; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; TENSILE STRENGTH; THIN FILMS; ULTRASONIC ABSORPTION; ULTRAVIOLET RADIATION; X RAY DIFFRACTION ANALYSIS;

DYNAMIC MECHANICAL ANALYSIS (DMA); FRACTURE SURFACES; POLYIMIDE-MICA HYBRID FILMS; ULTRASONIC DISPERSION TECHNIQUES;

POLYIMIDES;

CRYOGENICS;

EID: 21644455849     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2005.02.015     Document Type: Article

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