Rapid and selective post-etch residue removal for Cu and low-k devices

Solid State Technology

Volumn 48, Issue 6, 2005, Pages 47-52

  Reid, Chris ^a,b   Suzuki, Tomoko ^b   Hiraga, Toshitaka ^b  

^a Du Pont EKC Technology Ltd   (United Kingdom)

^b DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCIDENT PREVENTION; COPPER COMPOUNDS; ENVIRONMENTAL PROTECTION; ETCHING; PERMITTIVITY; RESIDUAL FUELS; WSI CIRCUITS;

COMPATIBILITY; LOW-TEMPERATURE DEVICES; POST-ETCH RESIDUES; SINGLE-WAFER REVOLUTION;

DIELECTRIC MATERIALS;

EID: 21644451468     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (0)