Peculiarities of the formation of the microrelief of copper-cobalt and copper-nickel plating alloys

Russian Journal of Electrochemistry

Volumn 33, Issue 1, 1997, Pages 84-86

  Kharlamov, V I ^a   Belous, O M ^a   Grigoryan, N S ^a   Terekhova, V V ^a   Vagramyan, T A ^a  

^a MENDELEEV UNIVERSITY OF CHEMICAL TECHNOLOGY OF RUSSIA   (Russian Federation)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 21444442515     PISSN: 10231935     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. Kruglikov, S.S. and Kovarskii, N.Ya., Itogi Nauki Tekh., Ser. Elektrokhim., 1975, vol. 10, p. 106.
2. Kruglikov, S.S., Vagramian, T.A., and Kharlamov, V.I., Abstracts of Papers, 37th Meeting International Society of Electrochemistry (Vilnius), Moscow: VINITI, 1986, vol. 2, p. 290.
3. Kharlamov, V.I., Kruglikov, S.S., and Vagramyan, T.A., Elektrokhimiya, 1989, vol. 25, p. 1701.
4. Purin, B.A., Elektroosazhdenie metallov iz pirofosfatnykh elektrolitov (Electrodeposition of Metals from Pyrophosphate Electrolytes), Riga: Zinatne, 1975.
5. Vagramyan, A.T. and Zhamagortsyants, M.A., Elektroosazhdenie metallov i ingibiruyushchaya adsorbtsiya (Electrodeposition of Metals and Inhibiting Adsorption), Moscow: Nauka, 1969.