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Volumn 30, Issue 3, 2004, Pages 205-207
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The Structure of Thermomigration Channels in Silicon
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Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 2142808154
PISSN: 10637850
EISSN: None
Source Type: Journal
DOI: 10.1134/1.1707168 Document Type: Article |
Times cited : (10)
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References (9)
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