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Volumn 5347, Issue , 2004, Pages 44-53

Developments in Si and SiO2 Etching for MEMS based optical applications

Author keywords

DRIE; Gas switching; High aspect ratio; MEMS; Si etch; SiO2 etch; Smooth sidewall

Indexed keywords

ASPECT RATIO; INDUCTIVELY COUPLED PLASMA; LIGHT INTERFERENCE; LIGHT REFLECTION; LIGHT TRANSMISSION; MICROELECTROMECHANICAL DEVICES; OPTICAL DEVICES; PLASMA ETCHING;

EID: 2142784216     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.524471     Document Type: Conference Paper
Times cited : (24)

References (11)
  • 5
    • 2142796476 scopus 로고
    • Patent No. DE4241045 (US 5501893)
    • F.Laermer, A.Schlip - Patent No. DE4241045 (US 5501893), 1994.
    • (1994)
    • Laermer, F.1    Schlip, A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.