Fourier and wavelet transform analysis of moire fringe patterns in electronic packaging

Microelectronics International

Volumn 21, Issue 2, 2004, Pages

  Xiong, C Y ^a   Zhang, J ^a   Li, M ^a   Fang, J ^a   Yi, S ^b  

^a PEKING UNIVERSITY   (China)

^b Department of Electrical and Computer Engineering   (United States)

Author keywords

Electronics industry; Fourier transforms; Packaging

Indexed keywords

EID: 2142768739     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565360410532024     Document Type: Article

References (8)