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Volumn 40, Issue 9-10, 2005, Pages 2377-2381
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Solid state spreading in the Cu/Cu system
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Author keywords
[No Author keywords available]
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Indexed keywords
BOLTZMANN CONSTANT;
ELECTRON BACKSCATTERING DIFFRACTION (EBSD);
SOLID STATE SPREADING;
SURFACE DIFFUSION;
ANNEALING;
BACKSCATTERING;
DIFFUSION;
ELECTRON DIFFRACTION;
GRAIN BOUNDARIES;
MOLECULAR BEAM EPITAXY;
POLYCRYSTALLINE MATERIALS;
REACTION KINETICS;
SCANNING ELECTRON MICROSCOPY;
THERMAL EFFECTS;
WETTING;
COPPER;
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EID: 21244502614
PISSN: 00222461
EISSN: 15734803
Source Type: Journal
DOI: 10.1007/s10853-005-1962-3 Document Type: Conference Paper |
Times cited : (15)
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References (14)
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