Effects of Si and C additions on the thermal stability of directionally solidified TiAl-Nb alloys

Intermetallics

Volumn 13, Issue 10, 2005, Pages 1038-1047

  Kim, J H ^a   Kim, S W ^a   Lee, H N ^b   Oh, M H ^c   Inui, H ^d   Wee, D M ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b LG Electronics Inc   (South Korea)

^c KIT   (South Korea)

^d KYOTO UNIVERSITY   (Japan)

Author keywords

A. Titanium aluminides, based on TiAl; B. Thermal stability; C. Crystal growth; D. Microstructure; F. Mechanical testing

Indexed keywords

ALUMINUM; CARBON; CRYSTAL GROWTH; HIGH TEMPERATURE EFFECTS; MECHANICAL TESTING; MELTING; MICROSTRUCTURE; SILICON; SOLIDIFICATION; THERMODYNAMIC STABILITY; TITANIUM COMPOUNDS; VOLUME FRACTION; YIELD STRESS;

DIRECTIONAL SOLIDIFICATION (DS); LAMELLAR BOUNDARIES; PHASE BOUNDARIES; TITANIUM ALUMINIDES, BASED ON TIAL;

TITANIUM ALLOYS;

EID: 21244468192     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2004.10.010     Document Type: Article

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