Reliability and wireability optimizations for chip placement on multichip modules

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 28, Issue 2, 2005, Pages 133-141

  Lee, Jing ^a  

^a SOUTHERN TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Force directed algorithm; Multichip module (MCM); Placement; Thermal force

Indexed keywords

ALGORITHMS; CHIP SCALE PACKAGES; MATHEMATICAL MODELS; OPTIMIZATION; RELIABILITY;

CHIP PLACEMENT; FORCED DIRECTED ALGORITHM; THERMAL FORCE;

MULTICHIP MODULES;

EID: 21244445907     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.848474     Document Type: Article

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