Heat-resistant epoxy-silicon hybrid materials for printed wiring boards

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 28, Issue 2, 2005, Pages 163-167

  Takahashi, Akio ^a   Satsu, Yuichi ^a   Nagai, Akira ^a   Umino, Morimichi ^a   Nakamura, Yoshihiro ^b  

^a HITACHI LTD   (Japan)

^b Resonac Corporation   (Japan)

Author keywords

Copper clad laminate; Epoxy silicon hybrid resin; FR 5; Heat resistant material; Pb free solder; Printed wiring board; Sol gel reaction

Indexed keywords

ELASTIC MODULI; EPOXY RESINS; GLASS TRANSITION; HEAT RESISTANCE; HIGH TEMPERATURE EFFECTS; LAMINATES; LSI CIRCUITS; MECHANICAL PROPERTIES; NANOSTRUCTURED MATERIALS; OLIGOMERS; PRINTED CIRCUIT BOARDS; THERMAL EXPANSION;

COPPER CLAD LAMINATE; EPOXY SILICON HYBRID RESIN; HEAT RESISTANT MATERIAL; LARGE SCALE INTEGRATION PACKAGING; SOL-GEL REACTION;

ELECTRONICS PACKAGING;

EID: 21244441199     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.846831     Document Type: Article

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