Thermal model of the MUPUS penetrator

International Journal of Heat and Mass Transfer

Volumn 48, Issue 18, 2005, Pages 3713-3721

  Seweryn, K ^a   Banaszkiewicz, M ^a   Grunwald, M ^b   Grygorczuk, J ^a   Spohn, T ^c  

^a Polish Academy of Science ^*  (Poland)

^b INSTITUTE OF AVIATION   (Poland)

^c GERMAN AEROSPACE CENTER DLR   (Germany)

Author keywords

FEM; MUPUS; Phylae; Radiation; Rosetta

Indexed keywords

FINITE ELEMENT METHOD; HEAT LOSSES; HEAT RADIATION; HEAT TRANSFER; MASS TRANSFER; MATHEMATICAL MODELS; NUMERICAL METHODS; SPECIFIC HEAT;

ELECTRONIC BOARDS; MUPUS PENETRATOR; THERMAL PARAMETERS; VACUUM CHAMBERS;

THERMAL INSULATING MATERIALS;

MODEL;

EID: 21144453976     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2005.04.003     Document Type: Article

References (7)

1. M. Banaszkiewicz, K. Seiferlin, EQM MUPUS PEN Vacuum-thermal Test Report RO-LMU-TR-002/EQM-VT-PEN Iss. 1 04.04.2000
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3. Thermal and physical properties of other materials (i.e. delrin, vespel, etc.) are obtained from http://www.goodfellow.com
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5. R. Siegel, and J.R. Howell Thermal Radiation Heat Transfer 1972 McGraw-Hill Book Co. New York pp. 235-277
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7. Ansys Release 8.0 Documentation, SAS IP Inc, 2003