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Volumn 15, Issue 7, 2005, Pages
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Creep-resistant aluminum alloys for use in MEMS
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM ALLOYS;
CHEMICAL MODIFICATION;
CHEMICAL RELAXATION;
CREEP;
HIGH TEMPERATURE EFFECTS;
PRECIPITATION (CHEMICAL);
STRESS ANALYSIS;
SUBSTRATES;
TENSILE STRENGTH;
CREEP PARAMETERS;
CREEP RATE;
CREEP RESISTANCE;
CURVATURE MEASUREMENTS;
MICROELECTROMECHANICAL DEVICES;
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EID: 21044437428
PISSN: 09601317
EISSN: None
Source Type: Journal
DOI: 10.1088/0960-1317/15/7/023 Document Type: Article |
Times cited : (34)
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References (19)
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