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Volumn 15, Issue 7, 2005, Pages

Creep-resistant aluminum alloys for use in MEMS

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; CHEMICAL MODIFICATION; CHEMICAL RELAXATION; CREEP; HIGH TEMPERATURE EFFECTS; PRECIPITATION (CHEMICAL); STRESS ANALYSIS; SUBSTRATES; TENSILE STRENGTH;

EID: 21044437428     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/7/023     Document Type: Article
Times cited : (34)

References (19)
  • 13
    • 21044438835 scopus 로고    scopus 로고
    • http://aluminium.matter.org.uk/content/html/eng/default.asp?catid= &pageid=1
  • 17
    • 0000519955 scopus 로고
    • Mechanical stress as a function of temperature for aluminum alloy films
    • Gardner D S and Flinn P A 1990 Mechanical stress as a function of temperature for aluminum alloy films J. Appl. Phys. 67 1831
    • (1990) J. Appl. Phys. , vol.67 , Issue.4 , pp. 1831
    • Gardner, D.S.1    Flinn, P.A.2
  • 19
    • 21044448141 scopus 로고    scopus 로고
    • Lokker H 2002 Mechanical and structural properties of Aluminum alloy thin films for microelectronic applications Doctoral Thesis Delft University chapter 7
    • (2002) Doctoral Thesis
    • Lokker, H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.