Micromechanical consideration of tensile crack behavior based on virtual internal bond in contrast to cohesive stress

Theoretical and Applied Fracture Mechanics

Volumn 43, Issue 3, 2005, Pages 342-359

  Zhang, Z N ^a   Ge, X R ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Isotropic solid; Micromechanical model; Tensile crack behaviors; Virtual internal bond

Indexed keywords

BONDING; CRACK INITIATION; CRACK PROPAGATION; DEGREES OF FREEDOM (MECHANICS); ELASTIC MODULI; POISSON RATIO; STIFFNESS; TENSILE STRESS;

COHESIVE STRESS METHOD; RELATIVE ROTATION FREEDOM; TENSILE CRACK BEHAVIOR; VIRTUAL INTERNAL BOND (VIB);

COMPOSITE MICROMECHANICS;

CRACKING; MICROMECHANICS;

EID: 21044433158     PISSN: 01678442     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tafmec.2005.03.005     Document Type: Article

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