Ductile-brittle transition at large negative tool rake angles

Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering

Volumn 66, Issue 7, 2000, Pages 1130-1134

  Yan, Jiwang ^a   Syoji, Katsuo ^a   Kuriyagawa, Tsunemoto ^a  

^a NONE

Author keywords

Chip formation; Cutting force; Diamond turning; Ductile brittle transition; Rake angle; Silicon

Indexed keywords

EID: 20844461085     PISSN: 09120289     EISSN: None     Source Type: Journal    
DOI: 10.2493/jjspe.66.1130     Document Type: Article

References (13)

1. P. N. Blake and R. O. Scattergood: Ductile Regime Machining of Germanium and Silicon, J. Amer. Ceram. Soc., 73, 4 (1990) 949.
2. T. Nakasuji, S. Kodera, S. Hara, H. Matsunaga, N. Ikawa and S. Shimada: Diamond Turning of Brittle Materials for Optical Components, Ann. CIRP, 39, 1 (1990) 89.
3. R. Komanduri: Some Aspects of Machining with Negative Rake Tools Simulating Grinding, Int. J. Mach. Tool Des. Res., 11 (1971) 223.
4. B.R. Lawn and M.V. Swain: Micro-facture beneath Point Indentations in Brittle Solids, J. Mater. Sci., 10 (1975) 113.
5. Z.J. Pei, S.R. Billingsley and S. Miura: Grinding Induced Subsurface Cracks in Silicon Wafers, Int. J. Mach. Tool Manuf., 39 (1999) 1103.
6. S. S. Chiang, D. B. Marshall and A. G. Evans: The Response of Solids to Elastic/Plastic Indentation, I. Stresses and Residual Stresses, J. Appl. Phys., 53,1 (1982) 298.