Stress in copper films for interconnects

Vide: Science, Technique et Applications

Volumn 53, Issue 283 SUPPL., 1997, Pages 148-149

  Riedel, S ^a   Rober J ^a   Schulz, S E ^a   Gessner T ^a  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 20544472654     PISSN: 12660167     EISSN: None     Source Type: Journal    
DOI: 10.1109/mam.1997.621096     Document Type: Article

References (3)

1. J. Röber and T. Geßner in Advanced Metallization for ULSI Applications 1994, edited by R. Blumenthal and G. Janssen (Mater. Res. Soc. Proc. ULSI Pittsburgh, PA, 1995) ; 133-136
2. A.M. Haghiri-Gosnet, F.R. Cadan, C. Mayeux, H. Lannois in Applied Surface Science 38 (1989) ; 295-303
3. W.D. Pilkey, Formulas for stress, strain and structural matrices, John Wiley & Sons Inc. 1994