A smart thermal environment monitor based on IEEE 1451.2 standard for global networking

IEEE Transactions on Instrumentation and Measurement

Volumn 54, Issue 3, 2005, Pages 1321-1326

  Wang, Yanfeng ^a   Nishikawa, Makoto ^b   Maeda, Ryuichi ^b   Fukunaga, Masaichi ^b   Watanabe, Kenzo ^a  

^a SHIZUOKA UNIVERSITY   (Japan)

^b PANASONIC CORPORATION   (Japan)

Author keywords

Energy saving; Environment; Measurement; Networking; Relative humidity; Smart interface; Temperature

Indexed keywords

ATMOSPHERIC HUMIDITY; CALIBRATION; COMPUTER NETWORKS; MICROCOMPUTERS; MONITORING; PLASTIC FILMS; RELAXATION OSCILLATORS; SENSORS; SIGNAL PROCESSING; STANDARDS; THERMISTORS; TRANSDUCERS;

ENERGY SAVING; GLOBAL NETWORKING; SMART INTERFACE; THERMAL ENVIRONMENT MONITOR;

TEMPERATURE MEASUREMENT;

EID: 20544432524     PISSN: 00189456     EISSN: None     Source Type: Journal    
DOI: 10.1109/TIM.2004.839767     Document Type: Article

References (6)

1. S Chen, K. Watanabe, M. Nakayama, M. Kanehori, H. Okayama, Y. Ito, and E. Kushime, "A low-cost, compact indoor thermal environment monitor," in Proc. IEEE Instrum. Meas. Technol. Conf., May 2000, pp. 290-294.
2. K. Lee, "IEEE 1451: A standard in support of smart transducer networking," in Proc. IEEE Instrum. Meas. Technol. Conf., May 2000, pp. 525-528.
3. K. Lee, B. Schneeman, and D. Richard, "Distributed measurement and control based on the IEEE 1451 smart transducer interface standards," in Proc. IEEE Instrum. Meas. Technol. Conf., May 1999, pp. 608-613.
4. H. Shibata, M. Ito, M. Asakursa, and K. Watanabe, "A digital hygrometer using a polyimide film relative humidity sensor," IEEE Trans. Instrum. Meas., vol. 45, no. 2, pp. 564-569, Apr. 1996.
5. M. Bertocco, F. Ferraris, C. Offelli, and M. Parvis, "A client-server architecture for distributed measurement systems," IEEE Trans. Instrum. Meas., vol. 47, no. 5, pp. 1143-1148, Oct. 1998.
6. M. A. Stegawshi and R. Schaumann, "A new virtual-instrumentation-based experimenting environment for undergraduate laboratories with application in research and manufacturing," IEEE Trans. Instrum. Meas., vol. 47, no. 6, pp. 1503-1506, Dec. 1998.