SCOPUS 정보 검색 플랫폼

IEEE Transactions on Electromagnetic Compatibility

Volumn 47, Issue 2, 2005, Pages 388-392

Traces in proximity to gaps in return planes

(3) Zeeff, Theodore M a Hubing, Todd H b Van Doren, Thomas P b

a HEWLETT PACKARD COMPANY (United States)

b University of Missouri Rolla (United States)

Author keywords

Analog; Common impedance; Coupling; Digital; Gapped; Ground islands; Ground plane; Isolation; Moating; Mutual capacitance; Mutual inductance; Printed circuit board

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; COUPLED CIRCUITS; CROSSTALK; INDUCTANCE;

GROUND ISLANDS; GROUND PLANE; MUTUAL CAPACITANCE; MUTUAL COUPLING; MUTUAL INDUCTANCE;

PRINTED CIRCUIT BOARDS;

EID: 20444491560 PISSN: 00189375 EISSN: None Source Type: Journal
DOI: 10.1109/TEMC.2005.847405 Document Type: Article

Times cited : (14)

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3
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4
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5
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6
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- "Lumped-element sections for modeling coupling between highspeed digital and I/O lines"
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- W. Cui, H. Shi, X. Luo, J. L. Drewniak, T. P. Van Doren, and T. Anderson, "Lumped-element sections for modeling coupling between highspeed digital and I/O lines," in Proc. Int. Symp. Electromagnetic Compatibility, Austin, TX, Aug. 1997, pp. 260-265.
- (1997) Proc. Int. Symp. Electromagnetic Compatibility , pp. 260-265
- Cui, W.¹ Shi, H.² Luo, X.³ Drewniak, J.L.⁴ Van Doren, T.P.⁵ Anderson, T.⁶

7
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- Maxwell 2-D Extractor Ver. 4.0.04 and Ansoft HFSS Ver 6.0, Ansoft Corporation, Pittsburgh, PA
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