Evaluation of stress field parameters for an interface crack in a bimaterial by digital photoelasticity

Journal of Strain Analysis for Engineering Design

Volumn 40, Issue 4, 2005, Pages 327-343

  Ravichandran, M ^a   Ramesh, K ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY MADRAS   (India)

Author keywords

Bimaterial; Interface crack; Multi parameter stress field equation; Photoelasticity; Stress intensity factor (SIF)

Indexed keywords

BONDING; DATA ACQUISITION; ELASTICITY; INTERFACES (MATERIALS); JOINTS (STRUCTURAL COMPONENTS); LEAST SQUARES APPROXIMATIONS; PARAMETER ESTIMATION; PHOTOELASTICITY; STRESS ANALYSIS;

BIMATERIALS; INTERFACE CRACK; MULTI-PARAMETER STRESS FIELD EQUATION; STRESS INTENSITY FACTOR (SIF);

CRACKS;

EID: 20444486926     PISSN: 03093247     EISSN: None     Source Type: Journal    
DOI: 10.1243/030932405X16034     Document Type: Article

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