Evolution of low sigma grain boundaries in PTC thermistors during sintering

Journal of the European Ceramic Society

Volumn 25, Issue 12 SPEC. ISS., 2005, Pages 3055-3058

  Seaton, J ^a,b   Leach, Colin ^a  

^a UNIVERSITY OF MANCHESTER   (United Kingdom)

^b Crown Industrial Estate   (United Kingdom)

Author keywords

BaTiO3 and titanates; EBSP; Grain boundaries; Interfaces; Thermistors

Indexed keywords

BARIUM TITANATE; ELECTRIC CONDUCTIVITY; GRAIN BOUNDARIES; GRAIN GROWTH; MICROSTRUCTURE; SINTERING;

CURIE TEMPERATURE; ELECTRON BACKSCATTER PATTERN (EBSP); POSITIVE TEMPERATURE COEFFICIENT (PTC); TRANSIENT LOADING;

THERMISTORS;

CERAMICS;

EID: 20444484500     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jeurceramsoc.2005.03.189     Document Type: Article

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