Data centers: Comparing data center & computer thermal design

ASHRAE Journal

Volumn 47, Issue 4, 2005, Pages 38-43

  Patterson, Michael K ^a   Steinbrecher, Robin ^a   Montgomery, Steve ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTERS; DATA COMMUNICATION EQUIPMENT; DATA PROCESSING; DESIGN; MECHANICAL ENGINEERING; OPTIMIZATION; SERVERS; THERMODYNAMICS;

DATA CENTERS; THERMAL DESIGN; THERMAL SOLUTION;

COOLING SYSTEMS;

EID: 20444407607     PISSN: 00012491     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. Processor Spec Finder, Intel Xeon Processors. http://processor-finder. intel.com/scripts/details.asp?sSpec=SL7PH&ProcFam=528&PkgType= ALL&SysBusSpd=ALL&CorSpd=ALL.
2. Beaty, D. and T. Davidson. 2003 "New guideline for data center cooling." ASHRAE Journal 45(12):28-34.
3. TC 9.9.2004. Thermal Guidelines for Data Processing Environments. ASHRAE Special Publications.
4. Koplin, E.C. 2003. "Data center cooling." ASHRAE Journal 45(3):46-53.
5. Rouhana, H. 2004. Personal communication. Mechanical Engineer, M+W Zander Mission Critical Facilities, Stuttgart, Germany, November 30.
6. Verein Deutscher Ingenieure, VDI 2054. 1994. Raumlufttechnische Anlagen für Datenverarbeitung September.