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Volumn 432, Issue 2, 2005, Pages 169-176

About models and methods to describe chip-calorimeters and determine sample properties from the measured signal

Author keywords

Calorimetry; Chip calorimeter; Heat capacity; IC calorimeter; Model

Indexed keywords

COMPUTER SIMULATION; HEAT CONDUCTION; HEAT FLUX; MICROPROCESSOR CHIPS; MODELS; PARTIAL DIFFERENTIAL EQUATIONS; SILICA; SPECIFIC HEAT; THERMODYNAMIC PROPERTIES; THIN FILMS;

EID: 20344407836     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2005.02.008     Document Type: Conference Paper
Times cited : (10)

References (17)
  • 6
    • 84892183006 scopus 로고    scopus 로고
    • 2601 DE Delft, The Netherlands
    • Xensor Integration, 2601 DE Delft, The Netherlands, http://www.xensor.nl.
    • Xensor Integration
  • 7
    • 20344395498 scopus 로고    scopus 로고
    • 07702 Jena, Germany
    • IPHT, 07702 Jena, Germany, http://ipht-jena.de.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.