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Volumn 80, Issue SUPPL., 2005, Pages 345-348
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Bias-stress-induced evolution of the dielectric properties of porous-ULK/ copper advanced interconnects
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Author keywords
Conduction; Defect; Dielectric; Poole Frenkel; Porous; Reliability; SiCOH; Transport; ULK
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Indexed keywords
CAPACITANCE;
COPPER;
CRYSTAL DEFECTS;
CURRENT DENSITY;
DIELECTRIC PROPERTIES OF SOLIDS;
ELECTRIC POTENTIAL;
INTEGRAL EQUATIONS;
LEAKAGE CURRENTS;
MATHEMATICAL MODELS;
PERMITTIVITY;
POROUS MATERIALS;
STRESSES;
CONDUCTION;
DIELECTRIC;
POOLE-FRENKEL MODELING;
POROUS;
SICOH;
TRANSPORT;
ULK;
INTERCONNECTION NETWORKS;
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EID: 19944379143
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mee.2005.04.089 Document Type: Conference Paper |
Times cited : (9)
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References (5)
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