Electroless deposition of pure nickel films from a simple solution consisting of nickel acetate and hydrazine

Plating and Surface Finishing

Volumn 92, Issue 4, 2005, Pages 58-62

  Yae, Shinji ^a   Ito, K ^a   Hamada, T ^a   Fukumuro, Naoki ^a   Matsuda, Hitosi ^a  

^a UNIVERSITY OF HYOGO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; ELECTROPLATING SOLUTIONS; FORMALDEHYDE; HYDRAZINE;

AUTOCATALYTIC PLATING SOLUTION; ELECTROLESS NICKEL DEPOSITION; NICKEL ACETATE;

NICKEL PLATING;

EID: 19944376512     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (12)

1. W. Riedel, Electroless Nickel Plating, ASM International, Materials Park, OH and Finishing Publications Ltd., Hertfordshire, UK, 1991; p.31.
2. D.J. Levy, Electrochem. Technol., 1, 38 (1963).
3. J.W. Dini & P.R. Coronado, Plating, 54, 385 (1967).
4. O. Takano, T. Shigeta & S. Ishibashi, J. Surf. Fin. Soc. Japan, 18, 466 (1967).
5. K. Aoki & O. Takano, Reports of Himeji Inst. Tech., 3lA, 82 (1978).
6. V.V. Sviridov, G.P. Shevchenko, A.S. Susha & N.A. Diab, J. Phys. Chem., 100, 19632 (1996).
7. S. Yae, K. Ito, K. Yamagishi & H. Matsuda, J. Surf. Fin. Soc. Japan, 51, 99 (2000).
8. S. Yae, K. Ito, H. Nakano, K. Yamagishi & H. Matsuda, Proc. Interfinish 15th World Congress 2000, Garmish-Partenkirchen, Germany, International Union for Surface Finishing, 2000, p. 135.
9. K. Ito, S. Yae, T. Hamada, H. Nakano, N. Fukumuro & H. Matsuda, Electrochemistry, 73 (2), in press (2005).
10. S. Yae, T. Hamada, A. Yokoyama, K. Ito, N. Fukumuro & H. Matsuda, J. Surf. Fin. Soc. Japan, 55, 89 (2004).
11. K. Yamagishi, S. Yae, N. Okamoto, N. Fukumuro, and H. Matsuda, J. Surf. Fin. Soc. Jpn., 54, 150 (2003).
12. L. G. Sillén, Stability Constants of Metal-Ion Complexes, The Chemical Society, London, UK, 1964; p. 158.