Low-frequency damping behavior of CuAIMn shape memory alloy

Physica Status Solidi (A) Applied Research

Volumn 201, Issue 13, 2004, Pages 2910-2914

  Wang, Q Z ^a   Han, F S ^a   Wang, Q ^b  

^a INSTITUTE OF SOLID STATE PHYSICS   (China)

^b HEFEI UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; COPPER ALLOYS; DAMPING; FRICTION; HIGH TEMPERATURE EFFECTS; LOW TEMPERATURE EFFECTS; MACHINING; MANGANESE ALLOYS; MARTENSITIC TRANSFORMATIONS; MICROSTRUCTURE;

LOW-FREQUENCY DAMPING; MICROSTRUCTURE DEFECTS; ROOM TEMPERATURE; THINNING PROCESS;

SHAPE MEMORY EFFECT;

EID: 19744380680     PISSN: 00318965     EISSN: None     Source Type: Journal    
DOI: 10.1002/pssa.200406855     Document Type: Article

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