Metallic adhesion in atomic-size junctions

Physical Review Letters

Volumn 93, Issue 11, 2004, Pages

  Rubio Bollinger, G ^a   Joyez, P ^a,b   Agrait N ^a  

^a UNIVERSIDAD AUTÓNOMA DE MADRID   (Spain)

^b SERVICE DE PHYSIQUE DE L ETAT CONDENSÉ   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ELECTRIC CONDUCTANCE; ELECTRIC CURRENTS; ELECTRODES; ELECTRON TRANSITIONS; GOLD; NANOTECHNOLOGY; SEMICONDUCTOR JUNCTIONS; SEPARATION; SOLDERING; VAN DER WAALS FORCES;

ATOMIC-SIZE JUNCTIONS; FORCE GRADIENTS; METALLIC ADHESION;

ATOMIC PHYSICS;

EID: 19644389612     PISSN: 00319007     EISSN: None     Source Type: Journal    
DOI: 10.1103/PhysRevLett.93.116803     Document Type: Article

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