A review of adhesive bonding techniques for joining medical materials

Assembly Automation

Volumn 25, Issue 2, 2005, Pages 100-105

  Tavakoli, S M ^a   Pullen, D A ^a   Dunkerton, S B ^a  

^a TWI LTD   (United Kingdom)

Author keywords

Adhesives; Medical equipment

Indexed keywords

ADHESIVES; BONDING; CURING; MEDICAL APPLICATIONS; POLYMERS; SURFACE TREATMENT;

ADHESIVE BONDING TECHNIQUES; MEDICAL MATERIALS;

BIOMEDICAL EQUIPMENT;

EID: 19444362230     PISSN: 01445154     EISSN: None     Source Type: Journal    
DOI: 10.1108/01445150510700070     Document Type: Review

References (10)

1. Dunkerton, S.B. (1995), "Joining of materials for medical applications", paper presented at the 3rd Annual Medical Design and Materials Conference, Amsterdam, 24-25 April.
2. Estes, R.H. (n.d.), "The suitability of epoxy-based adhesives for use in medical devices", Technical paper GB-63, Epoxy Technology, Inc.
3. Tavakoli, S.M. (1997), "Adhesive bonding in the medical industry, designing successful assemblies - critical issues in joining and bonding", paper presented at the Session 303, MEDTEC, The Netherlands, 21-23 October 1997.
4. Tavakoli, S.M. (2001a), "The adhesive bonding of medical devices", Medical Device & Diagnostic Industry, June, pp. 58-73.
5. Tavakoli, S.M. (2001b), "Sticking to the healthy option - using adhesive bonding in medical and implantable devices - part 1", TWI Bulletin, Vol. 42 No. 3, pp. 35-7.
6. Tavakoli, S.M. (2001c), "Sticking to the healthy option - using adhesive bonding in medical and implantable devices - part 2", TWI Bulletin, Vol. 42 No. 4, pp. 65-8.
7. Tavakoli, S.M. (2002a), "Adhesives and sealants in medicine, dentistry and pharmacy - a review of material applications, part I", TWI Bulletin, March/April, pp. 13-17.
8. Tavakoli, S.M. (2002b), "Adhesives and sealants in medicine, dentistry and pharmacy - a review of material applications, part II", TWI Bulletin, May/June, pp. 7-14.
9. Tavakoli, S.M., Nix, E.L. and Pacey, A.R. (1995), "Joining components of a cardiac catheter tip assembly with electronically conductive adhesives", paper presented at the ANTEC 95, Boston, MA, 7-11 May 1995, Vol. 3, pp. 3362-6.
10. , ANTEC 2001, 6-10 May.