Thermal expansion behavior and thermal mismatch stress of aluminum matrix composite reinforced by β-eucryptite particle and aluminum borate whisker

Materials Chemistry and Physics

Volumn 85, Issue 2-3, 2004, Pages 450-457

  Fei, W D ^a   Wang, L D ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Composite; Interfacial reaction; Thermal expansion coefficient; Thermal mismatch stress

Indexed keywords

CRYSTAL WHISKERS; DUCTILITY; REINFORCEMENT; STRESS ANALYSIS; THERMAL CONDUCTIVITY; THERMAL EXPANSION; TRANSMISSION ELECTRON MICROSCOPY;

INTERFACIAL REACTIONS; METAL MATRIX COMPOSITES (MMC); THERMAL EXPANSION COEFFICIENT; THERMAL MISMATCH STRESS;

METALLIC MATRIX COMPOSITES;

EID: 1942516272     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2004.02.004     Document Type: Article

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