Enhanced thermal management by direct water spray of high-voltage, high power devices in a three-phase, 18-hp AC motor drive demonstration

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 1007-1014

  Shaw, M C ^a   Waldrop, J R ^a   Chandrasekaran, S ^a   Kagalwala, B ^a   Jing, X ^a   Brown, E R ^b   Dhir, V J ^b   Fabbeo, M ^b  

^a ROCKWELL SCIENTIFIC COMPANY   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

AC motors; Electronic packaging thermal management; Energy management; Motor drives; Power system management; Switches; Thermal management; Thermal management of electronics; Thermal resistance; Thermal spraying

Indexed keywords

AC MOTORS; COOLING; ELECTRIC DRIVES; ELECTRIC LOSSES; ELECTRIC MOTORS; ELECTRIC SWITCHES; ELECTRON DEVICES; ELECTRONIC COOLING; ELECTRONICS PACKAGING; ENERGY MANAGEMENT; HEAT RESISTANCE; NOZZLE DESIGN; SPRAY STEELMAKING; SWITCHES; TEMPERATURE CONTROL; THERMAL VARIABLES CONTROL; VARIABLE SPEED DRIVES;

EFFECTIVE THERMAL RESISTANCE; ELECTRICAL ISOLATION; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; HIGH POWER DENSITY; MOTOR DRIVE; POWER SYSTEM MANAGEMENT; TECHNOLOGY ROADMAPS; THERMAL MANAGEMENT SYSTEMS;

THERMAL SPRAYING;

EID: 1942440774     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012567     Document Type: Conference Paper

References (9)

1. R.R. Tummala, and E.J. Rymaszewski, "Microelectronics Packaging Handbook," Van Nostrand Reinhold, New York, 1989.
2. J. Kaye, R.M. Fand, W.G. Nance and R.J. Nickerson, "Final Report on Heat-Storage Cooling of Electronic Equipment, Wright Air Development Center Technical Report 56-473, February, 1957.
3. V. W. Howard, "Research and Development Study on Thermal Control by Use of Fusible Materials, NASA Final Report, Contract NAS 8-11163, April, 1966
4. D.V. Hale, M.J. Hoover and M.J. O'Neill, "Phase Change Materials Handbook," NASA CR-61363, September, 1971
5. W.R. Humphries and E.I. Griggs, "A Design Handbook for Phase Change Thermal Control and Energy Storage Devices," NASA Technical Paper 1074, November 1977.
6. A. Bar-Cohen, "Thermal Management of Electronic Components with Dielectric Liquids, ASME Int'l J., Ser. B, V. 36, No. 1, 1993.
7. G.R. Blackwell, "The Electronic Packaging Handbook," CRC-IEEE Press, 1999.
8. th ed., 1984, CRC press.
9. M.C. Shaw and B.C. Beihoff, "Packaging of Integrated, Solid-State Power Assembly Cells: A Thermo-Mechanics-Based Approach," Proc., IEEE, Vol. 89, No. 6, June, 2001, Special Ed. on Power Electronics, J. D. van Wyk, F. C. Lee and D. Boroyevich, Eds.