SCOPUS 정보 검색 플랫폼

Volumn 105, Issue , 2005, Pages 465-470

Three-dimensional microstructure of thin copper foils revealed by ion beam cutting and electron backscatter diffraction (EBSD)

(4) Simons, G a Kunze, K b Hauffe, W c Dual, J a

a ETH ZURICH (Switzerland)

b GEOLOGICAL INSTITUTE (Switzerland)

c DRESDEN UNIVERSITY OF TECHNOLOGY (Germany)

Author keywords

EBSD; Tensile testing; Thin copper foils; Three dimensional microstructure

Indexed keywords

BACKSCATTERING; COPPER; CUTTING; ELECTRON DIFFRACTION; ELECTRON SCATTERING; ETCHING; FRACTURE; ION BEAMS; MICROSTRUCTURE; TENSILE TESTING; THREE DIMENSIONAL;

ELECTRON BACKSCATTER DIFFRACTION (EBSD); FOCUSED ION BEAM (FIB); THIN COPPER FOILS; THREE-DIMENSIONAL MICROSTRUCTURE;

METAL FOIL;

EID: 19344374979 PISSN: 10120394 EISSN: None Source Type: Book Series
DOI: 10.4028/www.scientific.net/ssp.105.465 Document Type: Conference Paper

Times cited : (5)

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