Local orientation gradient and recrystallization of deformed copper

Solid State Phenomena

Volumn 105, Issue , 2005, Pages 157-162

  Field, D P ^a   Nowell, M M ^b   Trivedi, P ^a   Wright, S I ^b   Lillo, T M ^c  

^a WASHINGTON STATE UNIVERSITY   (United States)

^b EDAX TSL   (United States)

^c IDAHO NATIONAL LABORATORY   (United States)

Author keywords

Copper; Electron Backscatter Diffraction (EBSD); Equal Channel Angular Extrusion; Recrystallization

Indexed keywords

DEFORMATION; ELECTROMAGNETIC WAVE BACKSCATTERING; ELECTRON DIFFRACTION; EXTRUSION; GRAIN BOUNDARIES; GRAIN GROWTH; NUCLEATION; RECRYSTALLIZATION (METALLURGY); SCANNING ELECTRON MICROSCOPY; TWINNING;

ELECTRON BACKSCATTERED DIFFRACTION (EBSD); EQUAL CHANNEL ANGULAR EXTRUSION (ECAE); GRAIN ORIENTATION; LATTICE ORIENTATION;

COPPER;

EID: 19344362808     PISSN: 10120394     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/ssp.105.157     Document Type: Conference Paper

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