A nonpenetrating 4PP measures USJ sheet resistance

Solid State Technology

Volumn 47, Issue 8, 2004, Pages

  Hillard, Robert J ^a   Mazur, Robert G ^a   Ye, C Win ^a   Benjamin, Mark C ^a   Borland, John O ^b  

^a Solid State Measurements Inc   (United States)

^b JOB Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MATERIALS; JUNCTION DEPTHS; PROBE SCRUBBING; SHEET RESISTANCE;

CARRIER CONCENTRATION; ELASTICITY; ELECTRIC RESISTANCE; PARAMETER ESTIMATION; PROBES; SEMICONDUCTOR JUNCTIONS; SENSITIVITY ANALYSIS; SILICON;

LITHOGRAPHY;

EID: 19244366556     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (6)

1. S. Wolf, The Submicron MOSFST, Vol. 3, Ch. 3, 1994.
2. "Sixth International Workshop on Fabrication, Characterization and Modeling of Ultra-Shallow Doping Profiles in Semiconductors," 2001 USJ Conf. Short Course.
3. "Sub-100nm CMOS," 2001 IEDM Conf. Short Course.
4. D.K. Schroder, Semiconductor Material and Device Characterization, J. Wiley and Sons, 1998.
5. R.J. Hillard, P.Y. Hung, W. Chism, C. Win Ye, W.H. Rowland, et al., "Characterization and Metrology for ULSI Technology," Proc. AIP Conf. 683, p. 796, 2003.
6. SSM SRP Seminar, 2002.