In situ nondestructive evaluation of the accumulative damage in continuous ceramic fiber-ceramic matrix composites (CFCCs) using submillimeter range electromagnetic wave

Advanced Engineering Materials

Volumn 6, Issue 8, 2004, Pages 681-683

  Guo, Shuqi ^a   Mamiya, Takayuki ^a   Kagawa, Yutaka ^a,b  

^a INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLENESS; CERAMIC FIBERS; CRACK INITIATION; DEBONDING; DUCTILITY; ELECTROMAGNETIC WAVES; FRACTURE TESTING; INFRARED IMAGING; NATURAL FREQUENCIES; NONDESTRUCTIVE EXAMINATION; REFLECTION; SUBMILLIMETER WAVES; THERMAL EFFECTS;

ACCUMULATIVE DAMAGES; MONOLITHICS; NONDESTRUCTIVE EVALUATIONS; STRUCTURAL COMPONENTS;

CERAMIC MATRIX COMPOSITES;

EID: 19244366239     PISSN: 14381656     EISSN: None     Source Type: Journal    
DOI: 10.1002/adem.200400033     Document Type: Article

References (16)

1. S. Prouhet, G. Camus, C. Labrugere, A. Guette, E. Martin, J. Am. Ceram. Soc. 1994, 77, 649.
2. J. A. Heathcote, X. Y. Gong, J. Y. Yang, U. Ramamurty, F. W. Zok, J. Am. Ceram. Soc. 1999, 82, 2721.
3. W. A. Ellingson, E. R. Koehl, J. G. Sun, C. Deemer, H. Lee, T. Spohnholtz, Mater. High Temp., 1999, 16, 213.
4. J. G. Sun, D. R. Petrak, T. A. K. Pillai, C. Deemer, W. A. Ellingson, Ceram. Eng. Sci. Proc. 1998, 19, 615.
5. H. Kaczmarek, Comp. Sci. Tech., 1993, 46, 67.
6. C. Deemer, J. G. Sun, W. A. Ellingson, S. Short, Ceram. Eng. Sci. Proc. 1999, 20, 317.
7. R. H. Bossi, J. Test. Eval., 1999, 27, 137.
8. R. Zoughi, S. Ganchev, G. W. Carriveau, Mater. Sci. Forum 1996, 210, 69.
9. S. Q. Guo, Y. Kagawa, J. Am. Ceram. Soc. 2001, 84, 2079.
10. T. Mamiya, Y. Kagawa, Y. Shioji, M. Sato, T. Yamamura, J. Am. Ceram. Soc. 2000, 83, 433.
11. A. C. Lynch, IEEE Trans. Instrum. Meas. 1974, 23, 425.
12. A. M. Nicolson, G. F. Ross, IEEE Trans. Instrum. Meas. 1970, 19, 377.
13. HP Product Note 8510-3, in Materials Measurement, Measuring the Dielectric Constant of Solids with the HP 8510 Network Analyzer, Agilent Technologies, Palo Alto, CA, USA.
14. D. K. Ghodgaonkar, V. V. Varadan, V. K. Varadan, IEEE Trans. Instrum. Meas. 1989, 38, 789.
15. D. K. Ghodgaonkar, V. V. Varadan, V. K. Varadan, IEEE Trans. Instrum. Meas. 1990, 39, 387.
16. S. J. Penn, N. M. Alford, A. Templeton, X. Wang, M. Xu, M. Reece, K. Schrapel, J. Am. Ceram. Soc. 1997, 80, 1885.