Transient liquid phase diffusion bonding with two-step heating process

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 26, Issue 4, 2005, Pages 69-72

  Chen, Si Jie ^a,b   Jing, Xiao Tian ^a   Li, Xin Geng ^c  

^a XI'AN UNIVERSITY OF TECHNOLOGY   (China)

^b HENAN POLYTECHNIC UNIVERSITY   (China)

^c STATE GRID SHANDONG ELECTRIC POWER RESEARCH INSTITUTE   (China)

Author keywords

Interlayer; Microstructures; Model; T91 steel; Transient liquid phase diffusion bonding; Two step heating temperature process

Indexed keywords

BOND STRENGTH (MATERIALS); COMPOSITION; MECHANICAL PROPERTIES; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; STEEL PIPE; TENSILE STRENGTH;

DIFFUSION BONDING; INTERLAYER; ISOTHERMAL SOLIDIFICATION; T91 STEEL; TRANSIENT LIQUID PHASE (TLP); TWO-STEP HEATING TEMPERATURE PROCESS;

WELDING;

EID: 19044378939     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

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