Dynamic strength and strain rate sensitivity of 37 wt% Pb 63 wt% Sn eutectic solders

Key Engineering Materials

Volumn 233-236, Issue I, 2002, Pages 181-186

  Wang, B ^a   Zheng, J ^a   Shu, D ^b  

^a BRUNEL UNIVERSITY   (United Kingdom)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Alloys; Flow stress; Impact load; Strain rate; Viscoplasticity

Indexed keywords

CREEP; DISLOCATIONS (CRYSTALS); EUTECTICS; GRAIN SIZE AND SHAPE; LEAD ALLOYS; MATHEMATICAL MODELS; PLASTIC FLOW; SOLDERED JOINTS; STRAIN RATE; TENSILE TESTING; VISCOPLASTICITY;

COWPER-SYMONDS MODEL; EUTECTIC SOLDERS; LEAD TIN ALLOYS;

SOLDERING ALLOYS;

EID: 18844477891     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

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