The preparation of mesoporous silica ultra-low-k film using ozone ashing treatment

Thin Solid Films

Volumn 483, Issue 1-2, 2005, Pages 283-286

  Cho, A T ^a   Pan, F M ^a,c   Chao, K J ^b   Liu, P H ^b   Chen, J Y ^c  

^a NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^c NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Low k; Mesoporous silica; Ozone ashing; Thin film

Indexed keywords

CURRENT DENSITY; ELASTIC MODULI; ETCHING; HYDROPHOBICITY; MESOPOROUS MATERIALS; OZONE; PERMITTIVITY; STRENGTH OF MATERIALS;

MESOPOROUS SILICA; NANO-POROUS FILMS; OZONE ASHING; SILICA FILMS;

SILICA;

EID: 18844426204     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.01.004     Document Type: Article

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