Dissolutive wetting of Ag on Cu: A molecular dynamics simulation study

Acta Materialia

Volumn 53, Issue 11, 2005, Pages 3163-3177

  Webb III, Edmund B ^a   Grest, Gary S ^a   Heine, David R ^a   Hoyt, J J ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Dissolution; Simulations; Wetting

Indexed keywords

COMPUTER SIMULATION; COPPER; DISSOLUTION; FILM GROWTH; MOLECULAR DYNAMICS; MONOLAYERS; THIN FILMS; WETTING;

DISSOLUTION REACTIONS; MOLECULAR DYNAMIC SIMULATIONS; MOLECULAR SCALE STRUCTURE; WETTING KINETICS;

SILVER;

EID: 18844412201     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2005.03.021     Document Type: Article

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