Facet preparation of SOI waveguides by etching and cleaving compared to dicing and polishing

2004 1st IEEE International Conference on Group IV Photonics

Volumn , Issue , 2004, Pages 72-74

  Schnarrenberger, Martin ^a   Zimmermann, Lars ^a   Mitze, Torsten ^a   Bruns, Jürgen ^a   Petermann, Klaus ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BROADBAND NETWORKS; ETCHING; FIBER OPTICS; OPTICAL COMMUNICATION; OPTICAL SYSTEMS; PHOTODIODES; POLISHING; RELIABILITY; SILICA; SILICON ON INSULATOR TECHNOLOGY;

CLEAVING PROCESS; DICING; PHOTOMASKS; SILICON-ON-INSULATOR (SOI) WAVEGUIDES;

OPTICAL WAVEGUIDES;

EID: 18844384436     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

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