Effect of DI water and intermediate rinse solutions on post metal etch residue removal using semi-aqueous cleaning chemistries

Diffusion and Defect Data Pt.B: Solid State Phenomena

Volumn 76-77, Issue , 2000, Pages 307-309

  Kirk, Simon J ^a   Small, Robert ^a  

^a EKC Technology Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMINES; CARBON DIOXIDE; COPPER; CORROSION; DIELECTRIC MATERIALS; ETCHING; FLUORINE COMPOUNDS; LOW TEMPERATURE OPERATIONS; PH; SEMICONDUCTOR DEVICE MANUFACTURE; SOLUTIONS; WATER;

FLUORIDE; INTERMEDIATE RINSE SOLUTIONS; POST METAL ETCH RESIDUE REMOVAL; SEMI AQUEOUS CLEANING; TUNGSTEN PLUG;

CHEMICAL CLEANING;

EID: 18544404066     PISSN: 10120394     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (0)