Internal friction of Ni-Ti and Ni-Ti-Cu plates produced by lamination process

Materials Science and Engineering: A

Volumn 370, Issue 1-2, 2004, Pages 560-563

  Igata, N ^a   Urahashi, N ^a   Sasaki, M ^b   Kogo, Y ^a  

^a TOKYO UNIVERSITY OF SCIENCE   (Japan)

^b Nippon Metal Industry Co Ltd   (Japan)

Author keywords

Dislocation; Electronic parameter; Internal friction; Ni Ti; Ni Ti Cu

Indexed keywords

DAMPING; DIFFUSION; ELASTIC MODULI; INTERNAL FRICTION; LAMINATING; MARTENSITIC TRANSFORMATIONS; PARAMETER ESTIMATION; PHASE TRANSITIONS; RELAXATION PROCESSES; STABILITY; THERMAL EFFECTS;

DISLOCATION MOTION; TWIN INTERFACE;

NICKEL ALLOYS;

INTERNAL FRICTION;

EID: 1842687069     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2003.08.101     Document Type: Article

References (4)

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3. M. Morinaga, N. Yukawa, H. Adachi, H. Ezaki, in: M. Gell, et al. (Eds.), New Phacomp and its Applications to Alloy Design, Superalloys 1984, AIME, 1984, pp. 523-532.
4. Otsuka K.Ren X. Intermetallics 7 1999 511-528