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Volumn 54, Issue 10, 1996, Pages 1167-1170

Optical interferometric determination of in-plane residual stresses in SiO2 films on silicon substrates

Author keywords

[No Author keywords available]

Indexed keywords

SILICON OXIDES;

EID: 1842675451     PISSN: 00255327     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article
Times cited : (2)

References (17)
  • 1
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    • Andonian, A.T.1    Danyluk, S.2
  • 3
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    • Metallization Deposition Parameters and Their Effect on Device Performance
    • Proceedings of an Institute of Applied Technology Symposium, held at Gaithersburg, MD, Jun. 2-3
    • Black, J.R., "Metallization Deposition Parameters and Their Effect on Device Performance," Silicon Device Processing, Proceedings of an Institute of Applied Technology Symposium, held at Gaithersburg, MD, Jun. 2-3, 1970, pp 298-408.
    • (1970) Silicon Device Processing , pp. 298-408
    • Black, J.R.1
  • 5
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    • Stress in Cathodic Plasma Oxides as a Function of Processing Parameters
    • Danksher, W., and A. Reisman, "Stress in Cathodic Plasma Oxides as a Function of Processing Parameters," Journal of Electronic Materials, Vol. 20, No. 1, 1991, p 103.
    • (1991) Journal of Electronic Materials , vol.20 , Issue.1 , pp. 103
    • Danksher, W.1    Reisman, A.2
  • 6
    • 0021214703 scopus 로고
    • On the Mechanics of Delamination and Spelling in Compressed Films
    • Evans, A.G., and J.W. Hutchinson, "On the Mechanics of Delamination and Spelling in Compressed Films," International Journal of Solids and Structures, Vol. 20, No. 5, 1984, pp 455-466.
    • (1984) International Journal of Solids and Structures , vol.20 , Issue.5 , pp. 455-466
    • Evans, A.G.1    Hutchinson, J.W.2
  • 7
    • 0023312081 scopus 로고
    • Measurement and Interpretation of Stresses in Aluminum-based Metallization as a Function of Thermal History
    • Mar.
    • Flinn, P.A., "Measurement and Interpretation of Stresses in Aluminum-based Metallization as a Function of Thermal History," IEEE Transactions on Electron Devices, Vol. ED. 34, No. 3, Mar. 1987.
    • (1987) IEEE Transactions on Electron Devices , vol.34 ED , Issue.3
    • Flinn, P.A.1
  • 9
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    • Stress Analysis of Encapsulated Fine-Line Aluminum Interconnect
    • Mar. 23
    • Jones, R.E., Jr., and M.L. Basehore, "Stress Analysis of Encapsulated Fine-Line Aluminum Interconnect," Applied Physics Letters, Vol. 50, No. 12, Mar. 23, 1987, pp 725-727.
    • (1987) Applied Physics Letters , vol.50 , Issue.12 , pp. 725-727
    • Jones Jr., R.E.1    Basehore, M.L.2
  • 10
    • 0027675555 scopus 로고
    • Determination of the Interfacial Tension by Zero Creep Experiment on Multilayers - I & II
    • Josell, D., and F. Spaepen, "Determination of the Interfacial Tension by Zero Creep Experiment on Multilayers - I & II," Acta Metallurgica, Vol. 41, No. 10, 1993, pp 3007-3015.
    • (1993) Acta Metallurgica , vol.41 , Issue.10 , pp. 3007-3015
    • Josell, D.1    Spaepen, F.2
  • 11
    • 0025445393 scopus 로고
    • The Evolution of Silicon Wafer Cleaning Technology
    • Jun.
    • Kern, W., "The Evolution of Silicon Wafer Cleaning Technology," Journal of the Electrochemical Society, Vol. 37, No. 6, Jun. 1990, p 1887.
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    • Kern, W.1
  • 12
    • 0025491731 scopus 로고
    • Crack Formation in Metallized Single Crystal Silicon Substrates
    • O'Brien, T., Y. Li, and S. Danyluk, "Crack Formation in Metallized Single Crystal Silicon Substrates," Journal of Electronic Materials, Vol. 19, No. 9, 1990, p 859.
    • (1990) Journal of Electronic Materials , vol.19 , Issue.9 , pp. 859
    • O'Brien, T.1    Li, Y.2    Danyluk, S.3
  • 13
    • 0003556126 scopus 로고
    • Residual Stress Measurement in Filament-evaporated Aluminum Films on Single Crystal Silicon Wafers
    • Park, H.W., and S. Danyluk, "Residual Stress Measurement in Filament-evaporated Aluminum Films on Single Crystal Silicon Wafers," Journal of Materials Science, Vol. 26, 1991, p 23.
    • (1991) Journal of Materials Science , vol.26 , pp. 23
    • Park, H.W.1    Danyluk, S.2
  • 14
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    • Moiré Interferometry Advances and Applications
    • Sep.
    • Post, D., "Moiré Interferometry Advances and Applications," Experimental Mechanics, Vol. 31, No. 3, Sep. 1991, p 276.
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  • 16
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    • Optical Method for Determining In-plane Residual Stresses in Thin, Flat, Circular Plates
    • submitted
    • Wang, B., S. Danyluk, and M. Billone, "Optical Method for Determining In-plane Residual Stresses in Thin, Flat, Circular Plates," submitted to Journal of Materials Science, 1996.
    • (1996) Journal of Materials Science
    • Wang, B.1    Danyluk, S.2    Billone, M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.