SCOPUS 정보 검색 플랫폼

Volumn 2, Issue 3, 2003, Pages 200-209

Cr photomask etc

Author keywords

Cr; Dry etch; Etch; Modeling; Plasma

Indexed keywords

EID: 1842599314 PISSN: 15371646 EISSN: None Source Type: Journal
DOI: 10.1117/1.158d828 Document Type: Article

Times cited : (15)

References (9)

1
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- Ruhl, G.¹ Dietrich, R.² Ludwig, R.³ Falk, N.⁴ Morrison, T.⁵ Stoehr, B.⁶

2
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- Plasma etch of binary Cr masks: CD uniformity study of photomasks utilizing varying Cr loads
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- Constantine, C.¹ Westerman, R.² Plumhoff, J.³

3
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- Impact of the loading effect on CD control in plasma etching of Cr photomasks using ZEP7000 resist
- F. Chen, W. Tsai, S. Chegwidden, S. Yu, M. Kamna, and J. Fam-sworth, "Impact of the loading effect on CD control in plasma etching of Cr photomasks using ZEP7000 resist," Proc. SPIE 3546, 429-437 (1998).
- (1998) Proc. SPIE , vol.3546 , pp. 429-437
- Chen, F.¹ Tsai, W.² Chegwidden, S.³ Yu, S.⁴ Kamna, M.⁵ Fam-sworth, J.⁶

4
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- C. J. Mogab, J. Eleclmchem. Soc. 124, 1262-1268 (1977).
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- Mogab, C.J.¹

5
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- D. L. Flamm, D. N. K. Wang, and D. Maydan, J. Electrocliem. Soc. 129, 2755-2760 (1982).
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- Flamm, D.L.¹ Wang, D.N.K.² Maydan, D.³

6
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- An endpoint solution for photomask chrome loads down to 0.25%
- M. J. Buie, B. Stoehr, A. Buxbaum, and G. Ruhl, "An endpoint solution for photomask chrome loads down to 0.25%," Proc. SPIE 4562, 616-623 (2001).
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- Buie, M.J.¹ Stoehr, B.² Buxbaum, A.³ Ruhl, G.⁴

7
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- Cr photomask etch performance and its modeling
- B. Wu and D. Chan, "Cr photomask etch performance and its modeling," Proc. SPIE 4889, 667-678 (2002).
- (2002) Proc. SPIE , vol.4889 , pp. 667-678
- Wu, B.¹ Chan, D.²

8
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- and pp. 260-263, Springer-Verlae, Berlin
- Handbook of Advanced Plasma Processing Techniques, R. J. Shul and S. J. Pearton, Eds., pp. 45-51, and pp. 260-263, Springer-Verlae, Berlin (2000).
- (2000) Handbook of Advanced Plasma Processing Techniques , pp. 45-51
- Shul, R.J.¹ Pearton, S.J.²

9
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- B. Wu and D. Chan, J. Microlithogr., Microfabr., Microsyst. 2(1), 54-60 (2003).
- (2003) J. Microlithogr., Microfabr., Microsyst. , vol.2 , Issue.1 , pp. 54-60
- B. Wu and D. Chan¹

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