SCOPUS 정보 검색 플랫폼

AESF SUR/FIN

Volumn , Issue , 2000, Pages 783-802

Immersion Silver Surface Finish: Usage Requirement Test Results & Production Experience

(2) Wenger, George M a Furrow, Robert G a

a NOKIA RESEARCH CENTER (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SURFACE FINISH; USAGE REQUIREMENT;

ELECTRIC CONDUCTIVITY; INSULATION; MASKS; NETWORKS (CIRCUITS); PRINTED CIRCUIT BOARDS; PRODUCTION ENGINEERING; RELIABILITY; SILVER; SOLDERED JOINTS; SOLDERING; SURFACE TREATMENT;

METAL FINISHING;

EID: 1842590597 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (1)

References (10)

1
- 5644229697
- CCAMTF, "A Collaborative Evaluation of Alternative Surface Finishes"
- Aug.
- Inman, R.L., etal, CCAMTF, "A Collaborative Evaluation of Alternative Surface Finishes", Circuit Assembly, Aug. 1997
- (1997) Circuit Assembly
- Inman, R.L.¹

2
- 0029707786
- Non-precious metal Finishes for Fine Pitch Assembly
- February
- McGrath, P. and Soutar, A., "Non-precious metal Finishes for Fine Pitch Assembly", Technical Proceeding Nepcon West, February 1996
- (1996) Technical Proceeding Nepcon West
- McGrath, P.¹ Soutar, A.²

3
- 84888952607
- Alternate Metal Finishes for Wire Bond and Soldering Applications
- Sept.
- Beigle, S., "Alternate Metal Finishes for Wire Bond and Soldering Applications", Surface Mount International, Sept. 1996
- (1996) Surface Mount International
- Beigle, S.¹

4
- 84888945450
- CCAMTF Test Results for Alternative Surface Finishes
- September 22
- Inman, R., etal, "CCAMTF Test Results for Alternative Surface Finishes", IPC National Conference: A Summit on Surface Finishes and PWB Solderability Workshop, September 22, 1999
- (1999) IPC National Conference: A Summit on Surface Finishes and PWB Solderability Workshop
- Inman, R.¹

5
- 84888948879
- Demonstrating the Relationship Between Wirebondability and Solderability of various Metallic Finishes for Use In Printed Circuit Assembly
- September
- Hillman, D., Bratin, P., and Pavlov, M., "Demonstrating the Relationship Between Wirebondability and Solderability of various Metallic Finishes for Use In Printed Circuit Assembly", Technical Proceeding Surface Mount International, September 1997
- (1997) Technical Proceeding Surface Mount International
- Hillman, D.¹ Bratin, P.² Pavlov, M.³

6
- 84888938994
- Immersion Silver As A Replacement For Solder Finish
- Reed, Jim, "Immersion Silver As A Replacement For Solder Finish", IPC Fall Meeting October 1998
- IPC Fall Meeting October 1998
- Reed, J.¹

7
- 84888971933
- Instituting a No Clean Process with Alternative to HASL Coatings in High Volume Production
- September 23
- Brunner, B, and Davis, R., "Instituting a No Clean Process with Alternative to HASL Coatings in High Volume Production", IPC National Conference: A Summit on Surface Finishes and PWB Solderability Workshop, September 23, 1998
- (1998) IPC National Conference: A Summit on Surface Finishes and PWB Solderability Workshop
- Brunner, B.¹ Davis, R.²

8
- 11744359755
- Alternative Metallic PWB - An Update on the ITRI/October Project
- April
- Houghton, F., "Alternative Metallic PWB - an Update on the ITRI/October Project", IPC Printed Circuits Expo, April 1998
- (1998) IPC Printed Circuits Expo
- Houghton, F.¹

9
- 0032682829
- The Performance and Attributes of the Immersion Silver Solderability Finish
- Feb.
- Parker J.L., "The Performance and Attributes of the Immersion Silver Solderability Finish", Technical Proceeding Nepcon West, Feb. 1999
- (1999) Technical Proceeding Nepcon West
- Parker, J.L.¹

10
- 84888975337
- Immersion Invasion
- Cullen, D., "Immersion Invasion", PC FAB, 1999
- (1999) PC FAB
- Cullen, D.¹

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