Copper electrodes multilayer ceramic capacitors: Part II Chips fabrication, optimisation and characterisation

Journal of Materials Science

Volumn 39, Issue 6, 2004, Pages 1959-1966

  Pollet, M ^a   Hochart, X ^b   Marinel, S ^a  

^a LABORATOIRE CRISMAT   (France)

^b Temex Ceramics   (France)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; COPPER; DIELECTRIC MATERIALS; DIELECTRIC PROPERTIES; ELECTRODES; MULTILAYERS; OXIDATION; PERMITTIVITY; SCANNING ELECTRON MICROSCOPY; SILICON; SINTERING;

INTRAGRANULAR PORES; PHASE COMPOSITION ANALYSIS;

CERAMIC CAPACITORS;

EID: 1842587606     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JMSC.0000017757.81363.41     Document Type: Article

References (7)

1. M. POLLET and S. MARINEL, J. Mater. Sci., submitted.
2. B. W. HAKKI and P. D. COLEMAN, IRE Trans. Microwave Techn. (1959) 402.
3. Y. KOBAYASHI and M. KATOH, IEEE Trans. Microwave Theory Techn. MTT-33(7) (1985) 586.
4. J. M. DURAND and P. Y. GUILLON, Electron. Lett. 22(2) (1986)63.
5. International Patent no. WO 98/25281.
6. R. E. MISTLER and E. R. TWINAME, "Tape Casting: Theory and Practice," edited by the American Ceramic Society (Newman, 2000) [ISBN 1-57-498029-7].
7. M. POLLET, S. MARINEL and G. DESGARDIN, J. Europ. Ceram. Soc., in press.