Methodology to design the interfaces in SiC/Al composites

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 32, Issue 6, 2001, Pages 1541-1550

  Lee, J C ^a   Ahn, J P ^a   Shi, Z ^a   Shim, J H ^a   Lee, H I ^a  

^a Korea Institute of Science and Technology   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; BOND STRENGTH (MATERIALS); GIBBS FREE ENERGY; INTERFACES (MATERIALS); METALLOGRAPHIC MICROSTRUCTURE; REACTION KINETICS; REINFORCEMENT; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; SURFACE TENSION; TRANSMISSION ELECTRON MICROSCOPY;

INTERFACIAL STABILITY;

METALLIC MATRIX COMPOSITES;

EID: 1842512317     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-001-0241-4     Document Type: Article

References (39)