Boiling performance of single-layered enhanced structures

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 374, Issue 2, 2003, Pages 175-181

  Ghiu, Camil Daniel ^a   Joshi, Yogendra K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC PRESSURE; COOLING; COPPER; DIELECTRIC MATERIALS; EVAPORATORS; FLUOROCARBONS; HEAT FLUX; HEAT TRANSFER; TRANSPORT PROPERTIES; TUBES (COMPONENTS);

ELECTRONIC COMPONENTS; MICROCHANNELS;

BOILING LIQUIDS;

EID: 1842482959     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-41764     Document Type: Conference Paper

References (8)

1. Thome, J.R., 1990, Enhanced Boiling Heat Transfer, Hemisphere Publishing, NY.
2. Webb, R. L., 1994, Principles of Enhanced Heat Transfer, John Wiley & Sons, NY.
3. Nakayama, W., Nakajima, T, and Hirasawa, S.,1984,"Heat Sink Studs Having Enhanced Boiling Surfaces For Cooling of Microelectronic Components", ASME Paper No. 84-WA/HT-89.
4. Ramaswamy, C.,"A Compact Two-Phase Thermosyphon Employing Microfabricated Boiling Enhancement Structures," Ph.D. dissertation, University of Maryland at College Park, MD.
5. Ramaswamy, C., Joshi, Y., Nakayama, W., and Johnson, W.B., 2003, "Effects of Varying Geometrical Parameters on Boiling From Microfabricated Enhanced Structures," ASME J. Heat Transfer, 125,pp.103-109.
6. th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp.349-355.
7. th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, vol.2, pp.310-311.
8. Arshad, J., and Thome, J.R., 1983, "Enhanced Boiling Surfaces: Heat Transfer Mechanism and Mixture Boiling", Proceedings of ASME-JSME Thermal Engineering Joint Conference, vol. 1, pp. 191-197.