Cluster of High Powered Racks within a Raised Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 374, Issue 2, 2003, Pages 245-262

  Schmidt, Roger ^a   Cruz, Ethan ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COOLING SYSTEMS; DATA PROCESSING; FLOORS; HEAT TRANSFER; MATHEMATICAL MODELS; TURBULENCE; VISCOSITY;

HIGH POWERED RACKS; PERFORATED TILE FLOW DISTRIBUTIONS; RACK INLET AIR TEMPERATURES; RAISED FLOORS;

COMPUTER WORKSTATIONS;

EID: 1842482918     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-42240     Document Type: Conference Paper

References (18)

1. The Uptime Institute, from the whitepaper entitled "Heat Density Trends in Data Processing, Computer Systems and Telecommunication Equipment" www.uptimeinstitute.org.
2. Schmidt, R., "Effect of Data Center Characteristics on Data Processing Equipment Inlet Temperatures", Advances in Electronic Packaging 2001 (Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition), Vol. 2, Paper IPACK2001-15870, Kauai, Hawaii, July 8-13, 2001, pp. 1097-1106.
3. Schmidt,R. and Cruz, E., "Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures of chilled Air Exiting both the Hot and Cold Aisles" Itherm Conference, San Diego, California, June, 2002, pp. 580-594.
4. Schmidt,R. and Cruz, E., "Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures when High Powered Racks are Situated Amongst Lower Powered Racks" IMECE Conference, New Orleans, La., Nov., 2002.
5. Schmidt,R. and Cruz, E., "Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures when Adjacent Racks are Removed" Interpack Conference, Maui, Hawaii, July 6 - 13, 2003, to be published.
6. Schmidt,R. and Cruz, E., "Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures when Rack Flowrates are Reduced" Interpack Conference, Maui, Hawaii, July 6-13, 2003, to be published.
7. Patel,C., Bash, C., Belady, C., Stahl, L., and Sullivan, D., "Computational Fluid Dynamics Modeling of High Compute Density Data Centers to Assure System Inlet Air Specifications", Advances in Electronic Packaging 2001 (Proceedings of IPACK '01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition), Vol. 2, Paper IPACK2001-15662, Kauai, Hawaii, July 8-13, 2001, pp. 821-829.
8. Patel C., Sharma. R., Bash, C., and Beitelmal, A., " Thermal Considerations in Cooling Large Scale Compute Density Data Centers," Itherm Conference, San Diego, California, June 2002, pp. 767 - 776.
9. Awbi, H.B., and Gan, G., "Predicting Air Flow and Thermal Comfort in Offices", ASHRAE Journal, February, 1994, pp. 17-21.
10. Bullock, C.E., and Phillip, F., "The Sistine Chapel:HVAC Design for Special-Use Buildings"ASHRAE Journal, April 1996, Vol. 38, No. 4, pp. 49-58.
11. Cinato, P., Bianco, C., Licciardi, L., Pizzuti, F., Antonetti, M., and Grossoni, M., "An Innovative Approach to the Environmental System Design for TLC rooms in Telecopm Italia", presented at Intelec98, 1998.
12. Kiff, P., "A Fresh Approach to Cooling Network Equipment", British Telecommunications Engineering, July, 1995.
13. Quivey, B., and Bailey, A.M., "Cooling of Large Computer Rooms - Design and Construction of ASCII0 TeraOps", Interpack99, June 1999, Maui, Hawaii.
14. Schmidt, R., "Thermal Management of Office Data Processing Centers", Advances in Electronic Packaging 1997(Proceedings of The Pacific Rim/ASME International Electronic Packaging Technical Conference, INTERpack '97), Vol. 2, EEP-Vol 19-2, Kohala Coast, Hawaii, June 15-19, 1997, pp. 1995-2010.
15. Seymour, M., "Dynamic Design on Atria", Building Services, January, 1992, pp. 27-29.
16. Kang, S., Schmidt, R., Kelkar, K., Patankar, S., "A Methodology for the Design of Perforated Tiles in Raised Floor Data Centers Using Computational Flow Analysis", IEEE-CPMT Journal, Vol. 24, No. 2, pp. 177-183, June 2001.
17. Schmidt, R., Karki, K., Kelkar, K., Radmehr, A., Patankar, S., "Measurements and Predictions of the Flow Distribution through Perforated Tiles in Raised Floor Data Centers", Advances in Electronic Packaging 2001 (Proceedings of IPACK '01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition), Vol. 2, Paper IPACK2001-15728, Kauai, Hawaii, July 8-13, 2001, pp. 905-914.
18. Flotherm Instruction Manual, Flomerics Ltd, U.K