Thermal Stability of Lamellar Structure of PST Crystal and Lamellar Boundary Design for Creep Resistant TiAl Alloy

Metals and Materials International

Volumn 9, Issue 3, 2003, Pages 255-263

  Kim, Hee Y ^a   Matsuda, J ^b   Maruyama, K ^b  

^a UNIVERSITY OF TSUKUBA   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

Creep; Intermetallic; Lamellar boundary; Lamellar microstructure; Microstructural degradation; Titanium aluminide

Indexed keywords

ALUMINUM ALLOYS; BINARY ALLOYS; CHROMIUM ALLOYS; COARSENING; CREEP; CREEP RESISTANCE; CREEP TESTING; CRYSTALS; HEAT TREATMENT; INTERMETALLICS; LAMELLAR STRUCTURES; STABILITY; THERMODYNAMIC STABILITY; TITANIUM ALLOYS;

CREEP DEFORMATION RESISTANCE; CREEP DEFORMATIONS; HIGH-TEMPERATURE EXPOSURE; LAMELLAR BOUNDARIES; LAMELLAR MICROSTRUCTURE; MICROSTRUCTURAL DEGRADATION; ORIENTATION VARIANTS; TITANIUM ALUMINIDES;

CRYSTAL STRUCTURE;

EID: 1842420411     PISSN: 15989623     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF03027044     Document Type: Article

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