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Volumn , Issue , 1996, Pages 589-592
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A 0.23μm2 Double Self-Aligned Contact Cell for Gigabit DRAMs With a Ge-Added Vertical Epitaxial Si Pald
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NEC CORPORATION
(Japan)
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Author keywords
[No Author keywords available]
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Indexed keywords
EPITAXIAL GROWTH;
ELECTRIC CURRENTS;
ELECTRIC RESISTANCE;
ELECTRIC WIRING;
GATES (TRANSISTOR);
MOSFET DEVICES;
RANDOM ACCESS STORAGE;
SEMICONDUCTING GERMANIUM;
SEMICONDUCTING SILICON;
SILICON NITRIDE;
ALIGNMENT TOLERANCE;
BIT LINES;
BIT-LINE ANDS;
CONTACT TECHNOLOGIES;
DESIGN RULES;
EPITAXIAL SI;
ETCH-STOP LAYERS;
GERMANIUMS (GE);
GIGABIT DRAM;
SELF ALIGNED CONTACTS;
DYNAMIC RANDOM ACCESS STORAGE;
CELLULAR ARRAYS;
ALIGNMENT TOLERANCE;
DOUBLE SELF ALIGNED CONTACT TECHNOLOGY;
DYNAMIC RANDOM ACCESS MEMORY;
EPITAXIAL PAD;
ETCH STOP LAYERS;
GROWTH RATE RATIO;
STACKED CAPACITOR MEMORY CELL;
VERTICAL EPITAXIAL GROWTH;
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EID: 18344401973
PISSN: 01631918
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IEDM.1996.554052 Document Type: Conference Paper |
Times cited : (5)
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References (6)
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