Microstructure and its scales of Cu-70%Sn peritectic alloy under high-temperature gradient directional solidification

Jinshu Xuebao/Acta Metallurgica Sinica

Volumn 41, Issue 4, 2005, Pages 411-416

  Li, Shuangming ^a   Ma, Baile ^a   Lu, Haiyan ^a   Liu, Lin ^a   Fu, Hengzhi ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

Cu 70 Sn peritectic alloy; Directional solidification; Microstructure; Primary dendritic arm spacing

Indexed keywords

EID: 18344383355     PISSN: 04121961     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (19)