On the morphological changes of Ni- and Ni(Pt)-silicides

Journal of the Electrochemical Society

Volumn 152, Issue 4, 2005, Pages

  Lee, P S ^a   Pey, K L ^b   Mangelinck, D ^c   Chi, D Z ^d   Osipowicz, T ^e  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c AIX MARSEILLE UNIVERSITÉ   (France)

^d INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

^e NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPLEMENTARY METAL OXIDE SEMICONDUCTORS (CMOS) DEVICES; FILM MORPHOLOGY; INTERFACE ENERGY; PHASE STABILITY;

AGGLOMERATION; DEPOSITION; GRAIN BOUNDARIES; INTERFACIAL ENERGY; PLATINUM; SCANNING ELECTRON MICROSCOPY; SILICA; TRANSMISSION ELECTRON MICROSCOPY;

NICKEL COMPOUNDS;

EID: 18344371372     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1862255     Document Type: Article

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